Bambu Filament Guide
This filament guide offers a comprehensive comparison of properties, application, and printing requirements for Bambu filaments, aiming to help users select the best-suited material for needs. Compare up to 4 materials by ticking their checkboxes. For detailed technical information, download filament technical data sheets (TDS) on product pages.
This filament guide offers a comprehensive comparison of properties, application, and printing requirements for Bambu filaments, aiming to help users select the best-suited material for needs. For detailed technical information, download filament technical data sheets (TDS) on product pages.
Compare:
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| Filament Properties | Toughness Impact Strength - XY | 26.6 kJ/m² | 52.7 kJ/m² | 39.3 kJ/m² | 41.0 kJ/m² | 34.8 kJ/m² | 123.2 kJ/m² | 23.2 kJ/m² | 41.2 kJ/m² | 36.0 kJ/m² | 57.5 kJ/m² | 40.3 kJ/m² |
Strength Bending Strength - XY | 76 MPa | 65 MPa | 62 MPa | 65 MPa | 108 MPa | N/A | 89 MPa | 70 MPa | 131 MPa | 125 MPa | 151 MPa | |
Stiffness Bending Modulus - XY | 2750 MPa | 1670 MPa | 1880 MPa | 1920 MPa | 2310 MPa | N/A | 3950 MPa | 2910 MPa | 5320 MPa | 4230 MPa | 5460 MPa | |
Layer Adhesion Impact Strength - Z | 13.8 kJ/m² | 13.6 kJ/m² | 7.4 kJ/m² | 4.9 kJ/m² | 9.0 kJ/m² | 86.3 kJ/m² | 7.8 kJ/m² | 10.7 kJ/m² | 4.5 kJ/m² | 13.3 kJ/m² | 15.5 kJ/m² | |
Heat Resistance HDT, 0.45 MPa | 57 ℃ | 69 ℃ | 87 ℃ | 100 ℃ | 117 ℃ | N/A | 55 °C | 74 °C | 205 °C | 194 °C | 186 ℃ | |
Saturated Water
Absorption Rate 25 ℃, 55% RH | 0.43% | 0.32% | 0.65% | 0.45% | 0.25% | 1.08% | 0.42% | 0.30% | 0.37% | 0.88% | 2.35% | |
| Pre-printing Preparation | Dry Out Before Use | Optional | Optional | Optional | Optional | Required | Required | Optional | Optional | Required | Required | Required |
Drying Condition | Blast Drying Oven: 55 °C, 8h X1 Series Heatbed: 65 - 75 °C, 12h | Blast Drying Oven: 65 °C, 8h X1 Series Heatbed: 75 - 85 °C, 12h | Blast Drying Oven: 80 °C, 8h X1 Series Heatbed: 90 - 100 °C, 12h | Blast Drying Oven: 80 °C, 8h X1 Series Heatbed: 90 - 100 °C, 12h | Blast Drying Oven: 80 °C, 8h X1 Series Heatbed: 90 - 100 °C, 12h | Blast Drying Oven: 70 °C, 8h X1 Series Heatbed: 80 - 90 °C, 12h | Blast Drying Oven: 55 °C, 8h X1 Series Heatbed: 65 - 75 °C, 12h | Blast Drying Oven: 65 °C, 8h X1 Series Heatbed: 75 - 85 °C, 12h | Blast Drying Oven: 80 °C, 8 - 12h X1 Series Heatbed: 90 - 100 °C, 12h | Blast Drying Oven: 80 °C, 8 - 12h X1 Series Heatbed: 90 - 100 °C, 12h | Blast Drying Oven: 80 °C, 8 - 12h X1 Series Heatbed: 90 - 100 °C, 12h | |
AMS Compatibility | ||||||||||||
Nozzle Size/Material | All Size/Material | All Size/Material | All Size/Material | All Size/Material | All Size/Material | 0.4 / 0.6 / 0.8 mm Hardened Steel / Stainless steel | 0.4 / 0.6 / 0.8 mm Hardened Steel | 0.4 / 0.6 / 0.8 mm Hardened Steel | 0.6(recommended) / 0.4 / 0.8 mm Hardened Steel | 0.6 (recommended) / 0.4 / 0.8 mm Hardened Steel | 0.6 (recommended) / 0.4 / 0.8 mm Hardened Steel | |
Build Plate
& Bed Temperature | Cool Plate(35-55°C) High Temperature Plate(55-65°C) Textured PEI Plate(55-65°C) | Engineering Plate(60-80°C) High Temperature Plate(60-80°C) Textured PEI Plate(60-80°C) | Engineering Plate(90-100°C) High Temperature Plate(90-100°C) Textured PEI Plate(90-100°C) | Engineering Plate(90-100°C) High Temperature Plate(90-100°C) Textured PEI Plate(90-100°C) | Engineering Plate(100-120°C) High Temperature Plate(100-120°C) Textured PEI Plate(100-120°C) | Cool Plate(30-35°C) Engineering Plate(30-45°C) High Temperature Plate(30-45°C) Textured PEI Plate(30-45°C) | Cool Plate(45-65°C) High Temperature Plate(45-65°C) Textured PEI Plate(55-65°C) | Engineering Plate(60-80°C) High Temperature Plate(60-80°C) Textured PEI Plate(60-80°C) | Engineering Plate(70-100°C) High Temperature Plate(70-100°C) Textured PEI Plate(70-100°C) | Engineering Plate(100-120°C) High Temperature Plate(100-120°C) Textured PEI Plate(100-120°C) | Engineering Plate(100-120°C) High Temperature Plate(100-120°C) Textured PEI Plate(100-120°C) | |
Adhesion Methods | Bambu Liquid Glue Glue Stick | Bambu Liquid Glue Glue Stick | Bambu Liquid Glue Glue Stick | Bambu Liquid Glue Glue Stick | Glue Stick | Bambu Liquid Glue Glue Stick | Bambu Liquid Glue Glue Stick | Bambu Liquid Glue Glue Stick | Glue Stick | Glue Stick | Glue Stick | |
| Printer Settings | Print with Enclosure | |||||||||||
Seal with Desiccant | ||||||||||||
Print Speed | < 300 mm/s | < 200 mm/s | < 300 mm/s | < 300 mm/s | < 300 mm/s | < 200 mm/s | < 250 mm/s | < 200 mm/s | < 100 mm/s | < 100 mm/s | < 100 mm/s | |
Nozzle Temperature | 190 - 230 ℃ | 240 - 270 ℃ | 240 - 280 ℃ | 240 - 280 ℃ | 260 - 290 ℃ | 220 - 240 ℃ | 210 - 240 ℃ | 240 - 270 ℃ | 260 - 300 ℃ | 260 - 300 ℃ | 260 - 300 ℃ | |
Part Cooling Fan | 50 - 100% | 0 - 60% | 0 - 80% | 0 - 80% | 0 - 60% | 50 - 100% | 50 - 100% | 0 - 40% | 0 - 40% | 0 - 40% | 0 - 40% | |
| Post-printing Processes | Annealing | 50 - 60 ℃ 6 - 12 hours | N/A | 80 - 90 ℃ 6 - 12 hours | 80 - 90 ℃ 6 - 12 hours | 85 - 100 ℃ 6 - 12 hours | N/A | 55 - 60 ℃ 6 - 12 hours | 65 - 70 ℃ 6 - 12 hours | 90 - 130 ℃ 6 - 12 hours | 90 - 130 ℃ 6 - 12 hours | 90 - 130 ℃, 6 - 12 hours |