Bambu Filament Guide
This filament guide offers a comprehensive comparison of properties, application, and printing requirements for Bambu filaments, aiming to help users select the best-suited material for needs. Compare up to 4 materials by ticking their checkboxes. For detailed technical information, download filament technical data sheets (TDS) on product pages.
This filament guide offers a comprehensive comparison of properties, application, and printing requirements for Bambu filaments, aiming to help users select the best-suited material for needs. For detailed technical information, download filament technical data sheets (TDS) on product pages.
Compare:
PLA
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PETG
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ABS
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ASA
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PC
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TPU 95A HF
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PLA-CF
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PETG-CF
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PET-CF
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PAHT-CF
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PA6-CF
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Filament Properties
Toughness
Impact Strength - XY
26.6 kJ/m²
52.7 kJ/m²
39.3 kJ/m²
41.0 kJ/m²
34.8 kJ/m²
123.2 kJ/m²
23.2 kJ/m²
41.2 kJ/m²
36.0 kJ/m²
57.5 kJ/m²
40.3 kJ/m²
Strength
Bending Strength - XY
76 MPa
65 MPa
62 MPa
65 MPa
108 MPa
N/A
89 MPa
70 MPa
131 MPa
125 MPa
151 MPa
Stiffness
Bending Modulus - XY
2750 MPa
1670 MPa
1880 MPa
1920 MPa
2310 MPa
N/A
3950 MPa
2910 MPa
5320 MPa
4230 MPa
5460 MPa
Layer Adhesion
Impact Strength - Z
13.8 kJ/m²
13.6 kJ/m²
7.4 kJ/m²
4.9 kJ/m²
9.0 kJ/m²
86.3 kJ/m²
7.8 kJ/m²
10.7 kJ/m²
4.5 kJ/m²
13.3 kJ/m²
15.5 kJ/m²
Heat Resistance
HDT, 0.45 MPa
57 ℃69 ℃87 ℃100 ℃117 ℃N/A55 °C74 °C205 °C194 °C186 ℃
Saturated Water Absorption Rate
25 ℃, 55% RH
0.43%0.32%0.65%0.45%0.25%1.08%0.42%0.30%0.37%0.88%2.35%
Pre-printing Preparation
Dry Out Before Use
OptionalOptionalOptionalOptionalRequiredRequiredOptionalOptionalRequiredRequiredRequired
Drying Condition
Blast Drying Oven: 55 °C, 8h X1 Series Heatbed: 65 - 75 °C, 12hBlast Drying Oven: 65 °C, 8h X1 Series Heatbed: 75 - 85 °C, 12hBlast Drying Oven: 80 °C, 8h X1 Series Heatbed: 90 - 100 °C, 12hBlast Drying Oven: 80 °C, 8h X1 Series Heatbed: 90 - 100 °C, 12hBlast Drying Oven: 80 °C, 8h X1 Series Heatbed: 90 - 100 °C, 12hBlast Drying Oven: 70 °C, 8h X1 Series Heatbed: 80 - 90 °C, 12hBlast Drying Oven: 55 °C, 8h X1 Series Heatbed: 65 - 75 °C, 12hBlast Drying Oven: 65 °C, 8h X1 Series Heatbed: 75 - 85 °C, 12hBlast Drying Oven: 80 °C, 8 - 12h X1 Series Heatbed: 90 - 100 °C, 12hBlast Drying Oven: 80 °C, 8 - 12h X1 Series Heatbed: 90 - 100 °C, 12hBlast Drying Oven: 80 °C, 8 - 12h X1 Series Heatbed: 90 - 100 °C, 12h
AMS Compatibility
Nozzle Size/Material
All Size/MaterialAll Size/MaterialAll Size/MaterialAll Size/MaterialAll Size/Material0.4 / 0.6 / 0.8 mm Hardened Steel / Stainless steel0.4 / 0.6 / 0.8 mm Hardened Steel0.4 / 0.6 / 0.8 mm Hardened Steel0.6(recommended) / 0.4 / 0.8 mm Hardened Steel0.6 (recommended) / 0.4 / 0.8 mm Hardened Steel0.6 (recommended) / 0.4 / 0.8 mm Hardened Steel
Build Plate & Bed Temperature
Cool Plate(35-55°C) High Temperature Plate(55-65°C) Textured PEI Plate(55-65°C)Engineering Plate(60-80°C) High Temperature Plate(60-80°C) Textured PEI Plate(60-80°C)Engineering Plate(90-100°C) High Temperature Plate(90-100°C) Textured PEI Plate(90-100°C)Engineering Plate(90-100°C) High Temperature Plate(90-100°C) Textured PEI Plate(90-100°C)Engineering Plate(100-120°C) High Temperature Plate(100-120°C) Textured PEI Plate(100-120°C)Cool Plate(30-35°C) Engineering Plate(30-45°C) High Temperature Plate(30-45°C) Textured PEI Plate(30-45°C)Cool Plate(45-65°C) High Temperature Plate(45-65°C) Textured PEI Plate(55-65°C)Engineering Plate(60-80°C) High Temperature Plate(60-80°C) Textured PEI Plate(60-80°C)Engineering Plate(70-100°C) High Temperature Plate(70-100°C) Textured PEI Plate(70-100°C)Engineering Plate(100-120°C) High Temperature Plate(100-120°C) Textured PEI Plate(100-120°C)Engineering Plate(100-120°C) High Temperature Plate(100-120°C) Textured PEI Plate(100-120°C)
Adhesion Methods
Bambu Liquid Glue Glue StickBambu Liquid Glue Glue StickBambu Liquid Glue Glue StickBambu Liquid Glue Glue StickGlue StickBambu Liquid Glue Glue StickBambu Liquid Glue Glue StickBambu Liquid Glue Glue StickGlue StickGlue StickGlue Stick
Printer Settings
Print with Enclosure
Seal with Desiccant
Print Speed
< 300 mm/s< 200 mm/s< 300 mm/s< 300 mm/s< 300 mm/s< 200 mm/s< 250 mm/s< 200 mm/s< 100 mm/s< 100 mm/s< 100 mm/s
Nozzle Temperature
190 - 230 ℃240 - 270 ℃240 - 280 ℃240 - 280 ℃260 - 290 ℃220 - 240 ℃210 - 240 ℃240 - 270 ℃260 - 300 ℃260 - 300 ℃260 - 300 ℃
Part Cooling Fan
50 - 100%0 - 60%0 - 80%0 - 80%0 - 60%50 - 100%50 - 100%0 - 40%0 - 40%0 - 40%0 - 40%
Post-printing Processes
Annealing
50 - 60 ℃ 6 - 12 hoursN/A80 - 90 ℃ 6 - 12 hours80 - 90 ℃ 6 - 12 hours85 - 100 ℃ 6 - 12 hoursN/A55 - 60 ℃ 6 - 12 hours65 - 70 ℃ 6 - 12 hours90 - 130 ℃ 6 - 12 hours90 - 130 ℃ 6 - 12 hours90 - 130 ℃, 6 - 12 hours